Components
Western Digital Intros World’s First 512 Gigabit 64-Layer 3D NAND Chip
Western Digital has today announced that it has commenced pilot production of the company’s 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan. Mass production...
Intel Readying New Chips to Battle AMD Ryzen
Intel is reportedly preparing two new Kaby Lake CPUs in the form of the Core i7-7740K and Core i5-7640K, which will both rock higher clock speeds, but also a higher TDP. The Core i7-7740K will ‘...
BIOSTAR Announces Z270 Racing Series Motherboards
BIOSTAR has announced the full line-up for the new 2nd-generation RACING series motherboards featuring support for Intel’s 7th-generation Core processors. Following the announcement last week of the f...
Thermaltake Launches new Tempered Glass Edition Chassis
Thermaltake has extended its chassis line-ups with three Tt LCS Certified cases – the Core X31, Core X71, and Suppressor F31 Tempered Glass Edition Chassis. The Core X31, Core X71, and Suppressor F31 ...
AMD Announces Ryzen Processors
AMD has announced its new high-performance desktop processors based on the innovative “Zen” core architecture (codenamed “Summit Ridge”) in advance of the official launch in Q1 2017. Drawing inspirati...
Lenovo Debuts Desktops and Notebooks Featuring 7th Gen AMD PRO Processors
Lenovo has launched the new ThinkCentre M715 Tiny, ThinkPad E475 and E575, featuring 7th Generation AMD PRO APUs (formerly codenamed “Bristol Ridge PRO”). AMD PRO APUs are built for business, with rob...