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Sandisk to showcase NAND innovation for AI at FMS 2026

At Future of Memory and Storage 2026 (FMS 26), Sandisk will showcase how NAND innovation is powering the next phase of AI infrastructure. As larger models, longer context windows, and agentic applicat...

Western Digital Intros World’s First 512 Gigabit 64-Layer 3D NAND Chip

Western Digital has today announced that it has commenced pilot production of the company’s 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan. Mass production...

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